The Automation Core

November 13, 2026 · 3D Stacked DRAM, AI Inference, Axelera Titania, Fractile, HBM Alternatives, LPDDR6, The Engineering Core, TSMC CoWoS,

November 12, 2026 · 3D IC, Huawei Tau Law, Hybrid Bonding, Kirin 2026, LogicFolding, Semiconductor Scaling, The Engineering Core, TSMC SoIC,

November 11, 2026 · Angstrom Node, Gate Pitch, Metal Pitch, Moore's Law, Process Node Naming, Semiconductor Scaling, The Engineering Core, TSMC A16,

November 10, 2026 · Advanced Packaging, AI Networking, Co-Packaged Optics, Near-Packaged Optics, NPO vs CPO, Optical Interconnect, pJ per bit, Silicon Photonics, Spectrum-X Photonics, The Engineering Core, TSMC COUPE,

November 09, 2026 · 1310 nm, AI Networking, Co-Packaged Optics, COUPE, CPO, Ge-on-Si, Germanium Photodetector, Optical Receiver, Silicon Photonics, SoIC, The Engineering Core, TIA, TSMC,

November 09, 2026 · 1T1C, 2T0C, 3D DRAM, BEOL Memory, IGZO, Memory Wall, On-Die Cache, Oxide Semiconductor, Semiconductor Process, SRAM, The Engineering Core, TSMC,

November 07, 2026 · 2nm, ALD, Channel Release, FinFET, GAA, Gate-All-Around, Inner Spacer, N2, Nanosheet, Selective Etch, Semiconductor Process, The Engineering Core, TSMC,

November 06, 2026 · AI Datacenter, Broadcom, COUPE, CPO, ELS, External Laser Source, Indirect Bandgap, InP Laser, Modulator, NVIDIA, Silicon Photonics, The Engineering Core, TSMC,

November 05, 2026 · ABF Substrate, Advanced Packaging, AI Chip, CoWoP, CoWoS, HBM, NVIDIA Rubin, PCB Packaging, Silicon Interposer, The Engineering Core, TSMC,

November 04, 2026 · Advanced Packaging, B200, CoWoS, CoWoS-L, CTE Mismatch, Liquid Cooling, NVIDIA Blackwell, The Engineering Core, Thermal Cycling, TSMC, Warpage,