·
3300V,
power electronics,
railway traction,
SiC MOSFET,
silicon carbide,
solid-state transformer,
SST,
surge current,
Toshiba,
·
800V,
AI data center,
Embedded Power Platform,
EPP,
EV powertrain,
GaN,
onsemi,
power density,
power electronics,
SiC,
solid-state circuit breaker,
SSCB,
Subaru,
The Engineering Core,
wafer-as-package,
wafer-level packaging,